PGC NEWS

The newest PlayStation 5 model, recently spotted in Australia, Japan, and parts of the United States, boasts a smaller and lighter heatsink. This design change results in a weight reduction of approximately 300 grams, as revealed in a recent teardown video by YouTuber Austin Evans.

Evans’s video compares the new PlayStation 5 model (CFI-1102A) with the original model (CFI-1000), showcasing a noticeably smaller heatsink design in the newer version. This reduction in size contributes significantly to the overall weight difference of around 300 grams.

Comparison of heatsinks between the old and new PlayStation 5 models

Interestingly, Evans’s testing revealed that the new model runs hotter than its predecessor, exhibiting a temperature increase of 3 to 5 degrees Celsius. The original PlayStation 5 featured a heatsink design utilizing heat pipes with specific shaping and venting to achieve performance comparable to a vapor chamber cooler. In the new design, Sony has significantly reduced the size of several components, including the heatsink itself, the copper heat pipes, and the cooling fins.

This redesign likely aims to address ongoing supply chain challenges and meet consumer demand, aligning with Sony’s previously confirmed plans to redesign the PlayStation 5. Based on his temperature readings, Evans concluded that the new PlayStation 5 model’s cooling solution is less efficient than the original, potentially increasing the desirability of the older model. “I don’t think there’s any argument that this is a worse console, at least thermally,” Evans added.

This design change raises questions about the long-term performance and reliability of the new PlayStation 5 model. While the weight reduction might be appealing to some, the increased operating temperature could be a concern for others, particularly in warmer climates. Further testing and real-world usage will be necessary to fully understand the implications of this design change.

In conclusion, the new PlayStation 5 model features a smaller, lighter heatsink, resulting in a 300-gram weight reduction. However, this change also leads to higher operating temperatures. While the redesign likely addresses production challenges, the long-term impact on performance and reliability remains to be seen. Whether this trade-off is worthwhile for consumers will depend on individual priorities and usage scenarios.